A HIGH RELIABILITY TO STAMPING
Automatic Press Bottom Dead Point Monitoring Device
Bottom Dead Center Reference Value Monitoring Device
> RM-7302 , RM-7304(VX)
Dynamic Displacement Acquisition System
Miss Detection Unit
Press Load Monitoring Device
> RM-7402 , RM-7404(VL)
Header Former Monitoring Unit
> RM-2803 , RM-2804(77)
Type of sensors
> RS-833H et al.
SG Spray System
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Press B.D.C. Monitoring and Recording Device
|Press B.D.C. Monitoring and Recording Device|
|RM-7302 (2ch) RM-7304 (4ch)|
|It can monitor the change over time of bottom dead center with color graphic monitor.
It is possible for continuous recording the data of bottom dead center into the USB flash memory.
It is very praxtical for traceability.
It samples the value of Bottom Dead Center and set the average data as reference value.
It compares the reference value and each shot.
☞It is adequate for monitoring the accuracy of bending,
or the thickness change of coining.
☞It is also adequit for monitoring the change over time of
bottom dead center.
●Bottom Dead Center Mode (B.D.C)
If a scarap was floated up between die mold and a stripper plate,
the stripper position is changed.
It can detect the Scrap Floating due to measuring this fluctuation of BDC.
●The First Bound Mode (1st Bound)
When a scrap is floated up during using die mold with high-pressure spring,
the scrap is almost smashed and too difficult to detect with BDC mode.
Therefore, the 1st Bound Mode catch the first contact point of stripper plate and material
before smash the floated scrap, and detect the scrap floating.
●External Timing Mode
Detect the BDC value by fixed angle.
|Download of the manual(PDF file) is available.|
*Select "Right click=Save the object into file" to save the data in a file.